SY120-GBM

Functional description

Overview

Revolutionized New Platform for All Integrated Smart & Secure Sensors

Next generation applications in logistics, robotics, automation, smart home and building, consumer and white goods, smart city and renewable energy require the adaption of smart and secure sensors with data connectivity. Existing semiconductor standard solutions often provide insufficient flexibility and missing software environment. The most critical item, however, is the missing inherent data security approach encompassing the complete value chain of the product.

The Solution

Sensry is a newly established company offers an smart edge sensor construction kit with highly flexible and customizable hardware configurations according to customer requirements. The universal sensor platform USeP combines cutting-edge assembly and packaging technologies with new design methods as well as various integration possibilities for sensors.

Features of the Generic Base Module (GBM)

Top level interface for extension PCB (i.e. sensors)
Support of multiple communication standards
Low power consumption
Multi-Core RISC-V performance for smart edge computing
Adequate memory resources
Inherent multi-layer data security and authentication
Fast design using standard library HW components
Smallest form factor due to advanced 3D-packaging
SDK & Toolchain available
Integration in fog, edge and cloud computing
Optional integration support from Sensry

Key Features

Processing Unit
- RISC-V based cluster core (max. 400MHz)
- 1 RISCY Data acquisition Unit (DAQU)
- 8 RISCY Data Proc. Units (DPU) with FPU
- Event bus
- DMA
Security features
- Crypto Co-Processor
- Secure Boot ROM
- Secure MRAM / SRAM
- True Random Number Generator (TRNG)
- One-Time-Programmable Memory (OTP) for Keys and Certificates
Interfaces
- 3x UART (up to 2Mbit/s, two of them with hardware handshake)
- 4x I2C (up to 400kHz)
- 4x I2S
- 7x SPI (up to 50MHz)
- CAN-FD
- RGMII with MDIO for Ethernet-Phy
- HyperBus (for external RAM/Flash)
- Debug JTAG
- 25MS/s 12bit SAR ADC
- 100kS/s 11bit ultra low power SAR ADC
- 16Bit Sigma Delta ADC (Audio)
- 32 GPIO (configurable for 1.8V or 3.3V operation)
- Each interface (except GPIO) can be induvidually disabled for power saving
Memory
- 512kB Secure MRAM
- 512kB MRAM
- 4MB SRAM
- Individual Data & Instruction Cache for the DPU

Interfaces

The 3D-System-in-Package provides numerous interfaces to the Top- and Bottom-Level.

The system has digital and analog interfaces to connect sensor devices to the system. There are three different Analog-to-Digital converters integrated. Two complex wired interfaces are supported by the Ganymed® core: Ethernet TSN and CAN-FD. These communication interfaces require an external physical layer. All interfaces are described in separate sections.

The Bottom-Level is the interface to the embedded customer system in form of a BGA-144 footprint with a pitch of 0.8mm and a ball diameter of 0.4mm. Please refer to section to find the footprint dimensions. The interface distribution is divided into several power and management pins and the I/ O interface. Figure 4 shows the general pin out of the device from top view

The Top-Level is the interface to the Package-on-Package sensor or peripheral parts. The application specific sensors are assembled on top side of the sensor PCB. The bottom side of the sensor PCB is the interface to the Ganymed® system. The interface includes power sources and different digital and analog interfaces. The Top-Level Figure 5 illustrates the different available interfaces.

Pin definitions

Top Level Footprint

Pad	Block	Signal	Voltage	Note
PT7	SPI0	SCK	1.8 V	System Clock
PT6	SPI0	SDO	1.8 V	Data Out
PT5	SPI0	SDI	1.8 V	Data In
PT9	SPI0	nCS0	1.8 V	Chip Select 0 (low active)
PT8	SPI0	nCS1	1.8 V	Chip Select 1 (low active)
PT12	SPI1	SCK	1.8 V	System Clock
PT11	SPI1	SDO	1.8 V	Data Out
PT10	SPI1	SDI	1.8 V	Data In
PT14	SPI1	nCS0	1.8 V	Chip Select 0 (low active)
PT13	SPI1	nCS1	1.8 V	Chip Select 1 (low active)
PR16	SPI2	SCK	1.8 V	System Clock
PT16	SPI2	SDO	1.8 V	Data Out
PT15	SPI2	SDI	1.8 V	Data In
PN16	SPI2	nCS0	1.8 V	Chip Select 0 (low active)
PP16	SPI2	nCS1	1.8 V	Chip Select 1 (low active)
PK1	QSPI	SCK	1.8 V	System Clock
PJ1	QSPI	SDIO0	1.8 V	Data0
PH1	QSPI	SDIO1	1.8 V	Data1
PG1	QSPI	SDIO2	1.8 V	Data2
PF1	QSPI	SDIO3	1.8 V	Data3
PL1	QSPI	CS	1.8 V	Chip Select
PT4	I2C0	SCL	1.8 V	Clock
PT3	I2C0	SDA	1.8 V	Data
PT2	I2C3	SCL	1.8 V	Clock
PT1	I2C3	SDA	1.8 V	Data
PH16	I2S0	SCK	1.8 V	Clock
PG16	I2S0	SDI	1.8 V	Data In
PJ16	I2S0	SWS	1.8 V	Word Select
PL16	I2S1	SCK	1.8 V	Clock
PK16	I2S1	SDI	1.8 V	Data In
PM16	I2S1	SWS	1.8 V	Word Select
PR1	UART1	RX	1.8 V	Receive
PP1	UART1	RX	1.8 V	Receive
PN1	UART1	RTS	1.8 V	Ready to Send
PM1	UART1	CTS	1.8 V	Clear to Send
PF16	GPIO	0	1.8 V
PE16	GPIO	1	1.8 V
PD16	GPIO	2	1.8 V
PC16	GPIO	3	1.8 V
PB16	GPIO	18	1.8 V
PA16	GPIO	19	1.8 V
PA15	GPIO	20	1.8 V
PA14	GPIO	21	1.8 V
PA5	HS-ADC0	VIN_P	Analog	High Speed ADC VIN_P 0
PA4	HS-ADC0	VIN_N	Analog	High Speed ADC VIN_N 0
PA2	HS-ADC1	VIN_P	Analog	High Speed ADC VIN_P 1
PA1	HS-ADC1	VIN_N	Analog	High Speed ADC VIN_N 1
PA10	LP-ADC	VIN_P	Analog	Low Power ADC VIN_P
PA11	LP-ADC	VIN_N	Analog	Low Power ADC VIN_N
PA6	HP-ADC	VIN_P	Analog	High Precision ADC VIN_P
PA3	HP-ADC	VIN_N	Analog	High Precision ADC VIN_N
PA7	RES	Reserved	Analog	Reserved Pin
PA9	RES	Reserved	Analog	Reserved Pin
PD1	VDD IO		3.3V	3.3V Supply
PE1	VDD IO		1.8V	1.8V Supply
PC1	VSS IO		GND	Digital GND
PA13	VDDA		1.8V	1.8V Analog Supply
PA12	VSSA		GND	Analog GND
PB1	Spare Through			Spare Through between PCB and Package Top Level

All the described signals and power supplies can be access on the top level. Any kind of digital or analog component which fits onto the size of the chip can be assembled on the Package Top-Level PCB.

Bottom Level Footprint

Notes:

Additional physical layer is needed to use the CAN or Ethernet TSN (RGMII) interface
The ADC0 and ADC4 interfaces are parallel connected High-Speed-ADC, Low-Power-ADC and High-Precision-ADC input:
- ADC0-VIN_P = HS-ADC0-VIN_P = LP-ADC-VIN_P = HP-ADC-VIN_P
- ADC0-VIN_N = HS-ADC0-VIN_N = LP-ADC-VIN_N = HP-ADC-VIN_N

Pad	Block	Signal	Voltage	Note
K6	UART0	TX	1.8 V	Transmit
L6	UART0	RX	1.8 V	Receive
N7	UART2	TX	3.3 V	Transmit
L7	UART2	RX	3.3 V	Receive
M7	UART2	RTS	3.3 V	Ready to Send
H8	UART2	CTS	3.3 V	Clear to Send
N11	SPI3	SCK	1.8 V	System Clock
M9	SPI3	SDO	1.8 V	Data Out
L9	SPI3	SDI	1.8 V	Data In
M10	SPI3	nCS0	1.8 V	Chip Select 0 (low active)
L10	SPI3	nCS1	1.8 V	Chip Select 1 (low active)
M11	SPI4	SCK	1.8 V	System Clock
N13	SPI4	SDO	1.8 V	Data Out
M12	SPI4	SDI	1.8 V	Data In
N12	SPI4	nCS0	1.8 V	Chip Select 0 (low active)
L12	SPI4	nCS1	1.8 V	Chip Select 1 (low active)
M13	SPI5	SCK	3.3 V	System Clock
L11	SPI5	SDO	3.3 V	Data Out
K10	SPI5	SDI	3.3 V	Data In
L13	SPI5	nCS0	3.3 V	Chip Select 0 (low active)
F8	SPI5	nCS1	3.3 V	Chip Select 1 (low active)
K11	SPI6	SCK	3.3 V	System Clock
J10	SPI6	SDO	3.3 V	Data Out
D7	SPI6	SDI	3.3 V	Data In
E7	SPI6	nCS0	3.3 V	Chip Select 0 (low active)
J12	SPI6	nCS1	3.3 V	Chip Select 1 (low active)
N10	I2C1	SCL	1.8 V	Clock
K8	I2C1	SDA	1.8 V	Data
N9	I2C2	SCL	3.3 V	Clock
L8	I2C2	SDA	3.3 V	Data
N8	I2C3	SCL	1.8 V	Clock - I2C3 is additionally available on Sensor Level
M8	I2C3	SDA	3.3 V	Data - I2C3 is additionally available on Sensor Level
A11	GPIO	4	1.8 V	General Purpose I/O and PWM
C11	GPIO	5	1.8 V	General Purpose I/O and PWM
A13	GPIO	6	1.8 V	General Purpose I/O and PWM
B12	GPIO	7	1.8 V	General Purpose I/O and PWM
D10	GPIO	8	3.3 V	General Purpose I/O and PWM
C12	GPIO	9	3.3 V	General Purpose I/O and PWM
B13	GPIO	10	3.3 V	General Purpose I/O and PWM
C13	GPIO	11	3.3 V	General Purpose I/O and PWM
F10	GPIO	12	3.3 V	General Purpose I/O and PWM
F11	GPIO	13	3.3 V	General Purpose I/O and PWM
F12	GPIO	14	3.3 V	General Purpose I/O and PWM
E13	GPIO	15	3.3 V	General Purpose I/O and PWM
B10	GPIO	16	1.8 V	General Purpose I/O and PWM
B11	GPIO	17	1.8 V	General Purpose I/O and PWM
B9	GPIO	22	1.8 V	General Purpose I/O and PWM
A10	GPIO	23	1.8 V	General Purpose I/O and PWM
E10	GPIO	24	1.8 V	General Purpose I/O and PWM
E11	GPIO	25	1.8 V	General Purpose I/O and PWM
E12	GPIO	26	1.8 V	General Purpose I/O and PWM
D11	GPIO	27	1.8 V	General Purpose I/O and PWM
D12	GPIO	28	1.8 V	General Purpose I/O and PWM
A12	GPIO	29	1.8 V	General Purpose I/O and PWM
D13	GPIO	30	1.8 V	General Purpose I/O and PWM
C10	GPIO	31	1.8 V	General Purpose I/O and PWM
M3	RGMII1	TXC	1.8 V	Reduced Gigabit Media Independent Interface
L4	RGMII1	TXD0	1.8 V	Reduced Gigabit Media Independent Interface
M4	RGMII1	TXD1	1.8 V	Reduced Gigabit Media Independent Interface
J2	RGMII1	TXD2	1.8 V	Reduced Gigabit Media Independent Interface
L5	RGMII1	TXD3	1.8 V	Reduced Gigabit Media Independent Interface
J4	RGMII1	TX_CTL	1.8 V	Reduced Gigabit Media Independent Interface
N2	RGMII1	RXC	1.8 V	Reduced Gigabit Media Independent Interface
K4	RGMII1	RXD0	1.8 V	Reduced Gigabit Media Independent Interface
N3	RGMII1	RXD1	1.8 V	Reduced Gigabit Media Independent Interface
N4	RGMII1	RXD2	1.8 V	Reduced Gigabit Media Independent Interface
H1	RGMII1	RXD3	1.8 V	Reduced Gigabit Media Independent Interface
L3	RGMII1	RX_CTL	1.8 V	Reduced Gigabit Media Independent Interface
N1	RGMII1	MDC	1.8 V	Reduced Gigabit Media Independent Interface
M2	RGMII1	MDIO	1.8 V	Reduced Gigabit Media Independent Interface
G2	CAN	IN	1.8 V	Controller Area Network Interface
G3	CAN	OUT	1.8 V	Controller Area Network Interface
G4	CAN	SHDN	1.8 V	Controller Area Network Interface
D1	JTAG0	TDI	3.3 V	Debug JTAG
E2	JTAG0	TDO	3.3 V	Debug JTAG
C3	JTAG0	TCK	3.3 V	Debug JTAG
D2	JTAG0	TMS	3.3 V	Debug JTAG
C4	JTAG0	TRST	3.3 V	Debug JTAG
E1	JTAG1	TDI	3.3 V	System-Test JTAG
E3	JTAG1	TDO	3.3 V	System-Test JTAG
G5	JTAG1	TCK	3.3 V	System-Test JTAG
F3	JTAG1	TMS	3.3 V	System-Test JTAG
F2	JTAG1	TRST	3.3 V	System-Test JTAG
G12	I2S0	SCK	1.8 V	Bit Clock
F13	I2S0	SWS	1.8 V	Word Select
G9	I2S0	SDI	1.8 V	Data
G11	I2S1	SCK	1.8V V	Bit Clock
G13	I2S1	SWS	1.8 V	Word Select
J13	I2S1	SDI	1.8 V	Data
H11	I2S2	SCK	3.3 V	Bit Clock
H12	I2S2	SWS	3.3 V	Left/Right Clock
H13	I2S2	SDI	3.3 V	Data
K13	I2S3	SCK	3.3 V	Bit Clock
K12	I2S3	SWS	3.3 V	Left/Right Clock
J11	I2S3	SDI	3.3 V	Data
A2	ADC0	VIN_P	analog	Parallel HS-ADC0-VIN_P, LP-ADC-VIN_P, HP-ADC-VIN_P
A3	ADC0	VIN_N	analog	Parallel HS-ADC0-VIN_N, LP-ADC-VIN_N, HP-ADC-VIN_N
A4	ADC1	VIN_P	analog	HS-ADC1-VIN_P
B1	ADC1	VIN_N	analog	HS-ADC1-VIN_N
J3	HYPERBUS	CS0	1.8 V	Chip Select 0
J1	HYPERBUS	CS1	1.8 V	Chip Select 1
H3	HYPERBUS	CLK_P	1.8 V	Differential Clock Positive
H2	HYPERBUS	CLK_N	1.8 V	Differential Clock Negative
K2	HYPERBUS	RWDS	1.8 V	Read/Write Select
L2	HYPERBUS	DQ0	1.8 V	Data 0
K1	HYPERBUS	DQ1	1.8 V	Data 1
F6	HYPERBUS	DQ2	1.8 V	Data 2
D5	HYPERBUS	DQ3	1.8 V	Data 3
L1	HYPERBUS	DQ4	1.8 V	Data 4
K3	HYPERBUS	DQ5	1.8 V	Data 5
M1	HYPERBUS	DQ6	1.8 V	Data 6
G1	HYPERBUS	DQ7	1.8 V	Data 7
B4	VIA	L3-L2		Through Package Via to Top Level
E4		RESET	3.3 V	System Reset (Low Active)
J7	VDD Digital		1.8 V	Supply
J8	VDD Digital		1.8 V	Supply
K7	VDD Digital		1.8 V	Supply
F4	VDD Digital		3.3 V	Supply
F5	VDD Digital		3.3 V	Supply
H4	VDD Digital		3.3 V	Supply
H5	VDD Digital		3.3 V	Supply
H6	VDD Digital		3.3 V	Supply
J5	VDD Digital		3.3 V	Supply
J6	VDD Digital		3.3 V	Supply
K5	VDD Digital		3.3 V	Supply
A9	VDD Analog		1.8V	Analog Sub-System Supply
B7	VDD Analog		1.8V	Analog Sub-System Supply
B8	VDD Analog		1.8V	Analog Sub-System Supply
C7	VDD Analog		1.8V	Analog Sub-System Supply
C8	VDD Analog		1.8V	Analog Sub-System Supply
C9	VDD Analog		1.8V	Analog Sub-System Supply
A6	VSS Analog		AGND	Analog Sub-System Ground
A7	VSS Analog		AGND	Analog Sub-System Ground
A8	VSS Analog		AGND	Analog Sub-System Ground
B5	VSS Analog		AGND	Analog Sub-System Ground
B6	VSS Analog		AGND	Analog Sub-System Ground
C5	VSS Analog		AGND	Analog Sub-System Ground
C6	VSS Analog		AGND	Analog Sub-System Ground
D8	VSS Digital		GND	Digital Ground
D9	VSS Digital		GND	Digital Ground
E8	VSS Digital		GND	Digital Ground
E9	VSS Digital		GND	Digital Ground
F9	VSS Digital		GND	Digital Ground
G10	VSS Digital		GND	Digital Ground
H9	VSS Digital		GND	Digital Ground
H10	VSS Digital		GND	Digital Ground
J9	VSS Digital		GND	Digital Ground
K9	VSS Digital		GND	Digital Ground
M6	VSS Digital		GND	Digital Ground
N6	VSS Digital		GND	Digital Ground
M5	VSS BIAS DPU		GND	DPU Bias Ground
N5	VSS BIAS DPU		GND	DPU Bias Ground
D3	BOOT MODE	BOOTM0	3.3 V	Bootloader settings
E5	BOOT MODE	BOOTM1	3.3 V	Bootloader settings
B3	Reserved			Set fix to GND
D6	Reserved			Set fix to GND
D4	Reserved			Don't connect
D4	Reserved			Don't connect
C1	Reserved			Don't connect
C2	Reserved			Don't connect
B2	Reserved			Don't connect
E6	Reserved			Don't connect
A5	Reserved			Don't connect
F1	Reserved			Don't connect

Power

IO voltage + Core voltage	1.8V
IO voltage + MRAM	3.3V
Maximum total power dissipation	< 1W

Two different power domains and one reference voltage are required for the Ganymed® system. On Top-Level the IO voltages are available to supply the sensors and peripherals.

Clocks

Low power operation clock/boot clock	32.768kHz
System reference clock	25MHz
System clocks (internal)	Generated from external clock via PLL, as required for functional units
CPU clock	400MHz maximum

All clocks are integrated in the package. No external clock or oscillator is needed for the system. The CPU clock frequency can be set exclusively by the DAQU CPU core. All DPU cores operate at the same clock frequency (unless disabled), while the DAQU core frequency may be different.